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Microfluidic Cooling of Electronic Components in Data Centers
Sponsored by Nano Manufacturing Lab at UC Berkeley and Google Inc.
Supervisor: Professor Hayden Taylor, Dr. Eehern Wong
Thermal Simulation
Coolant flow velocity
3D Printing Prototype
Thermal Simulation
1/12
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Designed a novel microfluidic integrated cooling system for 3D stacked MPSoCs for data center application.
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Performed analytical calculation and ABAQUS/Co-Simulation to optimize the structural design of micro-channel.
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Fabricated micro-channel using 3D printing and prototyped cooling system for experimental testing.
Skill Used:
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Thermal management and analysis
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Fluidic Mechanics
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Mechanical design, 3D CAD Modeling
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Material Selection: copper, DI water
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Simulation: Analytical: Matlab; Numerical: FEA, CFD
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Manufacturing Process: 3D printing, soft lithography
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